About Us
Chairman's Message
List of Committee
Events / Activities
Publication
 
Events / Activities
 

 
Overseas Delegation 2024 to Sweden - Mind-mapping Sustainable City
 


Date, time & venue

2024-03-29;;Sweden


Date, Time & Venue

2024-03-29 to 2024-04-07; Sweden


Programme Highlights

The HKIE-YMC Overseas Delegation is a sustainable programme that arouses young engineers’ potential in leadership and motivates their vision to learn from overseas experiences and good practices.

 

The YMC plans to organise a delegation to Sweden, with the theme “Mind-mapping Sustainable City”. Sweden is well known for the performance in achieving the 17 United Nation Sustainable Development Goals (UNSDGs).  Peaceful and democratic conditions have characterised the country for a long time and have enabled the development of a culture of collaboration between different actors in society – political, economic and social.

 

The delegates will explore the Sweden’s recipe of success in achieving good health and well-being, making clean energy affordable as well as fostering a sustainable city.  They will then study how the recipe could potentially be applied in Hong Kong.  On top, they will study how innovation and technology advancement could catalyze the achievements of above goals.


Delegation Fee

HK$12,800

(Air tickets, insurance, accommodation (shared room), meals and local transportation inclusive)

 

Registration & Enquiries

Application is open to all Registered Young Members and the number of delegates is limited to 16.  All candidates joining the delegation will go through a screening interview by delegation advisors and delegation manager.  Strong commitment to the delegation is expected.  For registration, please complete the online registration form at https://forms.gle/GCt8E6zhND932Cat6 by 20 Oct 2023.  For enquiries, please contact Ms Keiko Kam at email: keiko.kamwingsum@gmail.com.





Report

 
 

 
         
 

 

 
 
  Home | Contact Us | Copyright | Privacy Policy | Disclaimer | Sitemap | Admin
Copyright ©2008 The Hong Kong Institution of Engineers. All rights reserved.